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MPX5100AP データシート(PDF) 8 Page - Freescale Semiconductor, Inc

部品番号 MPX5100AP
部品情報  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  12 Pages
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メーカー  FREESCALE [Freescale Semiconductor, Inc]
ホームページ  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPX5100AP データシート(HTML) 8 Page - Freescale Semiconductor, Inc

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PACKAGE DIMENSIONS
PIN 1
F
G
N
L
R
12
34
5
6
6 PL
D
SEATING
PLANE
-T-
M
A
M
0.136 (0.005)
T
POSITIVE PRESSURE
(P1)
C
B
M
J
S
-A-
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
MAX
MILLIMETERS
INCHES
16.00
13.56
5.59
0.84
1.63
0.100 BSC
2.54 BSC
0.40
18.42
30˚ NOM
30˚ NOM
12.57
11.43
DIM
A
B
C
D
F
G
J
L
M
N
R
S
MIN
0.595
0.514
0.200
0.027
0.048
0.014
0.695
0.475
0.430
0.090
MAX
0.630
0.534
0.220
0.033
0.064
0.016
0.725
0.495
0.450
0.105
MIN
15.11
13.06
5.08
0.68
1.22
0.36
17.65
12.07
10.92
2.29
2.66
NOTES:
1.
2.
3.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
CASE 867-08
ISSUE N
UNIBODY PACKAGE
SEATING PLANE
R
N
C
J
PIN 1
M
Q
M
0.25
T
B
6X
D
G
F
S
K
V
S
P
M
0.173
Q S
T
L
U
A
1
2
34
5
6
T
P
P
Q
Q
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
MILLIMETERS
2.54 BSC
23.11 BSC
DIM
A
B
C
D
F
G
J
K
L
N
P
Q
R
S
U
V
MIN
29.08
17.4
7.75
0.68
1.22
0.36
17.65
7.37
10.67
3.89
3.89
5.84
5.59
4.62
MAX
29.85
18.16
8.26
0.84
1.63
0.41
18.42
7.62
11.18
4.04
4.04
6.35
6.1
4.93
NOTES:
1.
2.
DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
CASE 867B-04
ISSUE F
UNIBODY PACKAGE
MPX5100
Sensors
8
Freescale Semiconductor



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