Product Specification

SL1 ICS31 01

Rev. 1.2

July 2000

Page 14 of 22

Public

11 Handling Recommendations

Please refer to Philips ‘General Specification for 6” Wafer’ for the following items:

11.1 Sawing

11.2 Die Attach

11.3 Wire Bonding

12 Coil Specification

The I•CODE1 Label IC has to be connected at pads LA, LB to a coil characterised by its electrical

parameters according to Philips application note ‘I•CODE Label IC, Coil Design Guide’.