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170 データシート(PDF) 2 Page - Bi technologies |
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170 データシート(HTML) 2 Page - Bi technologies |
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2 / 2 page ![]() 7-14 Model 170 Substrate Alumina, beryllia, aluminum nitride, aluminum, copper Interconnect Layers 1 (crossover layers possible) Interconnect Material Copper Die Attach Solder attached, aluminum & gold wire bonding Package Construction Substrate base with plastic frame ELECTRICAL Semiconductor Components BJTs, FETs, Diodes, SCRs, IGBTs Capacitors Ceramic and tantalum Other Components Resistors, thermisters and various surface mount/solder mount components MECHANICAL ENVIRONMENTAL Custom power modules are typically designed to operate over a temperature range of -40°C to +125°C. |
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