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MCP2510-/ST データシート(PDF) 65 Page - Microchip Technology |
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MCP2510-/ST データシート(HTML) 65 Page - Microchip Technology |
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65 / 80 page  © 2007 Microchip Technology Inc. DS21291F-page 65 MCP2510 13.0 PACKAGING INFORMATION 13.1 Package Marking Information 18-Lead PDIP (300 mil) 18-Lead SOIC (300 mil) 20-Lead TSSOP (4.4 mm) XXXXXXXX XXXXXNNN YYWW XXXXXXXXXXXX XXXXXXXXXXXX XXXXXXXXXXXX YYWWNNN XXXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXXX YYWWNNN Example: Example: Example: MCP2510 I/STNNN 0728 MCP2510-I/SO XXXXXXXXXXXX XXXXXXXXXXXX 0737NNN MCP2510-I/P XXXXXXXXXXXXXXXXX 0726NNN Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e 3 e |
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