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TS914ID データシート(PDF) 15 Page - STMicroelectronics |
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TS914ID データシート(HTML) 15 Page - STMicroelectronics |
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15 / 19 page  TS914 Package mechanical data 15/19 5 Package mechanical data In order to meet environmental requirements, STMicroelectronics offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. |
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