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TC1303B-AO2EMF データシート(PDF) 28 Page - Microchip Technology |
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TC1303B-AO2EMF データシート(HTML) 28 Page - Microchip Technology |
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28 / 36 page ![]() TC1303A/TC1303B/TC1303C/TC1304 DS21949B-page 28 © 2005 Microchip Technology Inc. 10-Lead Plastic Dual Flat No Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated Exposed Pad Width Exposed Pad Length Lead Length *Controlling Parameter Lead Width Drawing No. C04-063 Notes: Exposed pad dimensions vary with paddle size. Overall Width D2 E2 L b D .016 .012 .008 .047 .055 .010 Number of Pins Standoff Lead Thickness Overall Length Overall Height Pitch e n Units A A1 E A3 Dimension Limits 10 .000 .001 .008 REF. .031 .020 BSC MIN INCHES NOM 0.40 0.25 0.30 .020 .069 .015 .096 0.18 1.20 1.39 0.50 0.30 1.75 2.45 0.02 0.80 0.20 REF. 0.50 BSC MILLIMETERS* .002 .039 0.00 MIN MAX NOM 10 0.05 1.00 MAX 3. Package may have one or more exposed tie bars at ends. 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. 0.90 .035 (Note 3) (Note 3) 4. JEDEC equivalent: Not registered Revised 05/24/04 .112 .118 .124 2.85 3.00 3.15 3.00 .112 .118 2.85 .124 3.15 -- -- -- -- E2 D A1 A A3 TOP VIEW EXPOSED METAL PAD BOTTOM VIEW 21 ID INDEX PIN 1 E L D2 p b n AREA (NOTE 2) TIE BAR (NOTE 1) EXPOSED |
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