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PACKAGE OUTLINE

C

TYP

6.2

5.8

1.75 MAX

12X 1.27

14X

0.51

0.31

2X

7.62

TYP

0.25

0.13

0 - 8

0.25

0.10

0.25

GAGE PLANE

1.27

0.40

A

NOTE 3

8.75

8.55

B

NOTE 4

4.0

3.8

4220718/A 09/2016

SOIC - 1.75 mm max height

D0014A

SMALL OUTLINE INTEGRATED CIRCUIT

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm, per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm, per side.

5. Reference JEDEC registration MS-012, variation AB.

1

14

0.25

C A B

8

7

PIN 1 ID

AREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 1.800