TS3USB31 datasheet(2/17 Pages) TI

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BLOCK DIAGRAM

HSD1+

HSD1–

Control

D+

D–

Absolute Maximum Ratings

(1)

Package Thermal Impedance

TS3USB31

HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH

WITH SINGLE ENABLE

SCDS242C – JULY 2007 – REVISED AUGUST 2007

TRUTH TABLE

FUNCTION

Disconnect

D+, D– = HSD+, HSD–

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

VIN

Control input voltage range(2)(3)

–0.5

HSD+, HSD–

–0.5 VCC + 0.3

VI/O

Switch I/O voltage range(2)(3)(4)

D+, D– when VCC > 0

–0.5 VCC + 0.3

D+, D– when VCC = 0

5.25

IIK

Control input clamp current

VIN < 0

–50

II/OK

I/O port clamp current

VI/O < 0

–50

II/O

ON-state switch current(5)

±64

Continuous current through VCC or GND

±100

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

VI and VO are used to denote specific conditions for VI/O.

(5)

II and IO are used to denote specific conditions for II/O.

TYP

UNIT

θJA

Package thermal impedance(1)

RSE package

253

°C/W

(1)

The package thermal impedance is calculated in accordance with JESD 51-7.

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