AD8222

Preliminary Technical Data

Rev. PrA | Page 4 of 4

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.

1

0.65

BSC

0.60 MAX

PIN 1

INDICATOR

1.95 BCS

0.50

0.40

0.30

0.25 MIN

3.75

BSC SQ

TOP VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

COPLANARITY

0.08

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

4.00

BSC SQ

2.65

2.50 SQ

2.35

16

5

13

8

9

12

4

EXPOSED

PAD

BOTTOM VIEW

Figure 2. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-16-13)

Dimensions are shown in millimeters

©2007 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

PR06979-0-8/07(PrA)