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STA5620 データシート(PDF) 25 Page - STMicroelectronics |
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STA5620 データシート(HTML) 25 Page - STMicroelectronics |
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25 / 29 page ![]() STA5620 Package information 25/29 9 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 6. VFQFPN 32L (5x5x1.0mm) mechanical data and package dimensions OUTLINE AND MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 0.800 0.900 1.000 0.031 0.035 0.039 A 0.800 0.900 1.000 0.0315 0.0354 0.0394 A1 0.020 0.050 0.0008 0.0020 A3 0.200 0.0079 b 0.180 0.250 0.300 0.0071 0.0098 0.0118 D 4.850 5.000 5.150 0.1909 0.1969 0.2028 D2 3.500 3.600 3.700 0.1378 0.1417 0.1457 E 4.850 5.000 5.150 0.1909 0.1969 0.2028 E2 3.500 3.600 3.700 0.1378 0.1417 0.1457 e 0.500 0.0197 L 0.300 0.400 0.500 0.0118 0.0157 0.0197 ddd 0.050 0.0020 VFQFPN32 (5x5x1.0mm) Very Fine Quad Flat Package No lead 7376875 F |
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