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High Speed CMOS Logic – 54HC74

Rev 1.0

21/11/17

PARAMETER

SYMBOL

MIN

MAX

UNITS

Supply Voltage

VCC

2.0

6.0

V

DC Input Voltage, Output Voltage

VIN, VOUT

0

VCC

V

Operating Temperature Range

TJ

-55

+125

°C

VCC=2.5V

0

1000

VCC=4.5V

0

500

Input Rise / Fall Time

VCC=6.0V

tr, tf

0

400

ns

Recommended Operating Conditions3 (Voltages referenced to GND)

Absolute Maximum Ratings1

PARAMETER

SYMBOL

VALUE

UNIT

DC Supply Voltage (Referenced to GND)

VCC

-0.5 to +7.0

V

DC Input or Output Voltage (Referenced to GND)

VIN, VOUT

-1.5 to VCC+1.5

V

Storage Temperature Range

TSTG

-65 to 150

°C

Input Current (per Pad)

IIN

±20

mA

Output Current (per Pad)

IOUT

±25

mA

DC Supply Current, VCC or GND, per pad

ICC

±50

mA

Power Dissipation in Still Air

2

PD

750

mW

 

DC Electrical Characteristics (Voltages referenced to GND)

LIMITS

PARAMETER

SYMBOL

VCC

CONDITIONS

25°C

85°C

FULL RANGE

4

UNITS

2.0

1.5

1.5

1.5

4.5

3.15

3.15

3.15

Minimum High-Level

Input Voltage

VIH

6.0

VOUT = 0.1V

or VCC -0.1V

│IOUT│≤ 20µA

4.2

4.2

4.2

V

2.0

0.5

0.5

0.5

4.5

1.35

1.35

1.35

Maximum Low-Level

Input Voltage

VIL

6.0

VOUT = 0.1V

or VCC -0.1V

│IOUT│≤ 20µA

1.8

1.8

1.8

V

2.0

1.9

1.9

1.9

4.5

4.4

4.4

4.4

6.0

VIN = VIH or VIL

│IOUT│≤ 20µA

5.9

5.9

5.9

V

4.5

VIN = VIH or VIL

│IOUT│≤ 4.0mA

3.98

3.84

3.7

V

Minimum High-Level

Output Voltage

VOH

6.0

VIN = VIH or VIL

│IOUT│≤ 5.2mA

5.48

5.34

5.2

V

3.  This device contains protection circuitry against damage due to high static voltages or electric fields. However, precautions must be taken to avoid

applications of voltage higher than max rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to range

GND ≤ (VIN or VOUT) ≤ VCC. Unused inputs must be tied to an appropriate logic voltage level (e.g., GND or VCC). Unused outputs must be left open.

1.  Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may

reduce device reliability. 2. Measured in plastic DIP package, results in die form are dependent on die attach and assembly method.