ADS1174IPAPR datasheet(28/35 Pages) TI

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PowerPAD THERMALLY-ENHANCED

ICDie

WireBond

LeadframeDiePad

ExposedatBaseofPackage

DieAttachEpoxy

(thermallyconductive)

Leadframe

MoldCompount

(Epoxy)

ADS1174

ADS1178

SBAS373 – OCTOBER 2007

die pad to be attached to the PCB using standard

PACKAGING

flow soldering techniques. This soldering allows

efficient attachment to the PCB and permits the board

The PowerPAD concept is implemented in standard

structure to be used as a heat-sink for the package.

epoxy resin package material. The integrated circuit

Using a thermal pad identical in size to the die pad

is attached to the leadframe die pad using thermally

and vias connected to the PCB ground plane, the

conductive epoxy. The package is molded so that the

board designer can now implement power packaging

leadframe die pad is exposed at a surface of the

without additional thermal hardware (for example,

package. This exposure provides an extremely low

external heat sinks) or the need for specialized

thermal resistance to the path between the IC

assembly instructions.

junction and the exterior case. The external surface

of the leadframe die pad is located on the printed

Figure 29 illustrates a cross-section view of a

circuit board (PCB) side of the package, allowing the

PowerPAD package.

Figure 29. Cross-Section View of a PowerPAD Thermally-Enhanced Package

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