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TUSB1044AI データシート(PDF) 64 Page - Texas Instruments |
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TUSB1044AI データシート(HTML) 64 Page - Texas Instruments |
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64 / 66 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN ALL AROUND 0.05 MAX ALL AROUND 40X (0.2) 40X (0.6) ( ) TYP VIA 0.2 36X (0.4) (3.8) (5.8) 4X (1.1) (4.7) (R ) TYP 0.05 (2.7) 2X (2.1) 6X (0.75) WQFN - 0.8 mm max height RNQ0040A PLASTIC QUAD FLATPACK - NO LEAD 4222125/B 01/2016 SYMM 1 8 9 20 21 28 29 40 SYMM LAND PATTERN EXAMPLE SCALE:15X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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