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STV7622 データシート(PDF) 22 Page - STMicroelectronics |
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STV7622 データシート(HTML) 22 Page - STMicroelectronics |
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22 / 32 page ![]() Pad dimensions and positions (in µm) STV7622 22/32 11 Pad dimensions and positions (in µm) The reference (x=0, y=0) is the centre of the die. Output pad pitch is 76.5 µm. Pad placement coordinate values correspond to the center of each bump pad center. Pad size is specified for bumping. Table 13. Pad placement and bump pad dimensions (in microns) Lead pad name Pad placements Bump dimensions X Y X Y TOP SIDE from left to right OUT192 -7303.1 624.2 43.5 65.6 OUT191 -7226.6 624.2 43.5 65.6 OUT190 -7150.1 624.2 43.5 65.6 OUT189 -7073.6 624.2 43.5 65.6 OUT188 -6997.1 624.2 43.5 65.6 OUT187 -6920.6 624.2 43.5 65.6 OUT186 -6844.1 624.2 43.5 65.6 OUT185 -6767.6 624.2 43.5 65.6 OUT184 -6691.1 624.2 43.5 65.6 OUT183 -6614.6 624.2 43.5 65.6 OUT182 -6538.1 624.2 43.5 65.6 OUT181 -6461.6 624.2 43.5 65.6 OUT180 -6385.1 624.2 43.5 65.6 OUT179 -6308.6 624.2 43.5 65.6 OUT178 -6232.1 624.2 43.5 65.6 OUT177 -6155.6 624.2 43.5 65.6 OUT176 -6079.1 624.2 43.5 65.6 OUT175 -6002.6 624.2 43.5 65.6 OUT174 -5926.1 624.2 43.5 65.6 OUT173 -5849.6 624.2 43.5 65.6 OUT172 -5773.1 624.2 43.5 65.6 OUT171 -5696.6 624.2 43.5 65.6 OUT170 -5620.1 624.2 43.5 65.6 OUT169 -5543.6 624.2 43.5 65.6 OUT168 -5467.1 624.2 43.5 65.6 OUT167 -5390.6 624.2 43.5 65.6 OUT166 -5314.1 624.2 43.5 65.6 |
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