FN8862 Rev.1.00

Page 7 of 27

Jul 27, 2017

ISL72027ASEH

2. Specifications

2.

Specifications

2.1

Absolute Maximum Ratings

2.2

Thermal Information

Parameter

Minimum

Maximum

Unit

VCC to GND with/without Ion Beam

-0.3

5.5

V

CANH, CANL, VREF Under Ion Beam

±20

V

CANH, CANL, VREF

±20

V

I/O Voltages D, R, RS

-0.5

7

V

Receiver Output Current

-10

10

mA

Output Short-Circuit Duration

Continuous

ESD Rating

Value

Unit

Human Body Model (Tested per MIL-STD-883 TM3015.7)

CANH, CANL Bus Pins

4kV

All Other Pins

4kV

Charged Device Model (Tested per JS-002-2014)

750

V

Machine Model (Tested per JESD22-A115C)

200

V

CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may

adversely impact product reliability and result in failures not covered by warranty.

Thermal Resistance (Typical)

JA (°C/W)

JC (°C/W)

8 Ld FP Package (Notes 5, 6)39

7

Notes:

5.

JA is measured with the component mounted on a high-effective thermal conductivity test board (two buried 1oz copper planes)

with “direct attach” features package base mounted to PCB thermal land with a 10 mil gap fill material having a thermal

conductivity of 1W/m-K. Refer to TB379.

6. For

JC, the “case temp” location is the center of the package underside.

Parameter

Minimum

Maximum

Unit

Maximum Junction Temperature

+150

°C

Storage Temperature Range

-65

+150

°C