processing - stencil/screen solder paste, then oven reflow.

Due to board thickness, component density, and other

circumstances that dictate the required reflow temperature,

Comus Technology uses a higher temperature solder for all

internal connections. We recommend that the temperature

(measured at the reed switch leads) does not exceed 260°C

for 1 minute. Temperature and time in excess of the rec-

ommended levels may result in damage to the reed switch.

Handling Force

When possible don’t add pressure on the glass on placing

the reed switch on a pcb or device. However when han-

dling with a Pick and Place machine the acceptable force

on the reed switch is 3N with a max of 5N.

• As part of the company policy of continued product improvement, specifications

may change without notice. Our sales office will be pleased to help you with the

latest information on this product range and the details of our full design and

manufacturing service. All products are supplied to our standard conditions of

sale unless otherwise agreed in writing.

RI-07 SMD Series Dry Reed Switch

USA Tel: +(1)973 777 6900 / Fax: +(1) 973 777 8405 ▪ Belgium Tel: + 32 (0)12 390400

Page 3 of 4

Recommended Soldering Reflow Profile

All Dimension in inches (mm) nominal

Dimensions for RI-07 SMD Tape and Reel

0.079 (2)

0.157 (4) Pitch

0.081 (2.05)

0.768 (19.5)

B-B

A-A

B

B

A

A

0.012 (0.3)

1.118 (28.4)

0.559 (14.2)

0.071 (1.8)

1.260 (32)

0.157 (4) Pitch

Ø 0.059 (1.5)

* Each tape and reel contains 5,000 pieces.