SC561

13

Layout Considerations

While layout for linear devices is generally not as critical

as for a switching application, careful attention to detail

will ensure reliable operation. The diagram below illus-

trates proper layout of a circuit.

Attach the part to a large copper footprint, to

enable better heat transfer from the device on

PCBs where there are internal power and ground

planes.

•

Applications Information (continued)

Place the input, output, and bypass capacitors

close to the device for optimal transient

response and device behavior.

Connect all ground connections directly to the

ground plane whenever possible to minimize

ground potential differences on the PCB.

•

•

Scale = 20:1 (20mm = 1mm)

Layer 1

Layer 2

Via between Layer 1

and Layer 2

SC561