Chip Topographies

Package Information

For the latest package outline information and land patterns

(footprints), go to

www.maximintegrated.com/packages. Note

that a “+”, “#”, or “-” in the package code indicates RoHS status

only. Package drawings may show a different suffix character, but

the drawing pertains to the package regardless of RoHS status.

GND

CAP+

BOOST

0.076"

(1.930mm)

0.076"

(1.930mm)

CAP-

VOUT

V+

OSC

LV

TRANSISTOR COUNT: 72

SUBSTRATE CONNECTED TO V+

MAX1044

GND

CAP-

LV

VOUT

TRANSISTOR COUNT: 71

SUBSTRATE CONNECTED TO V+

CAP+

0.084"

(2.1mm)

0.060"

(1.5mm)

V+

OSC

ICL7660

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

6 TDFN-EP

T633-2

21-0036

90-0058

8 Plastic DIP

P8+1

21-0043

—

8 SOIC

S8+2

21-0041

90-0096

8 CERDIP

J8+2

21-0045

—

8 µMAX

U8+1

21-0036

90-0092

8 TO-99

T99-8

21-0022

—

MAX1044/ICL7660

Switched-Capacitor Voltage Converters

www.maximintegrated.com

Maxim Integrated │ 13