2007-04-02

6

SFH 303, SFH 303 FA

Maßzeichnung

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch).

Lötbedingungen

Soldering Conditions

Wellenlöten (TTW)

(nach CECC 00802)

TTW Soldering

(acc. to CECC 00802)

9.0 (0.354)

8.2 (0.323)

25.2 (0.992)

24.2 (0.953)

1.8 (0.071)

1.2 (0.047)

7.8 (0.307)

7.5 (0.295)

11.5 (0.453)

10.9 (0.429)

6.9 (0.272)

5.1 (0.201)

4.8 (0.189)

5.9 (0.232)

5.5 (0.217)

0.6 (0.024)

0.4 (0.016)

B

Chip position

Area not flat

GEOY6351

CE

OHLY0598

0

0

50

100

150

200

250

50

100

150

200

250

300

T

t

C

s

235 C

10 s

C

... 260

1. Welle

1. wave

2. Welle

2. wave

5 K/s

2 K/s

ca 200 K/s

CC

... 130

100

2 K/s

Zwangskühlung

forced cooling

Normalkurve

standard curve

Grenzkurven

limit curves