Package information

STA264

4/6

3

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 2.

TFBGA 249 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.200

0.0472

A1

0.210

0.0083

A2

0.790

0.0311

A3

0.200

0.0079

A4

0.600

0.0236

b

0.350

0.400

0.450 0.0138 0.0157 0.0177

D

14.850 15.000 15.150 0.5846 0.5906 0.5965

D1

12.800

0.5039

E

14.850 15.000 15.150 0.5846 0.5906 0.5965

E1

12.800

0.5039

e

0.800

0.0315

F

1.100

0.0433

ddd

0.100

0.0039

eee

0.150

0.0059

fff

0.080

0.0031

TFBGA 240+9 (15x15x1.2mm)

Thin Profile Pitch Ball Grid Array

7272773 C