TMP821

SLDS152A – JANUARY 2008 – REVISED MAY 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VCC

Supply voltage

30

V

VAL

Output voltage (AL)

30

V

IOUT

Continuous output current (A1, A2)

70

mA

IAL

Continuous output current (AL)

8

mA

TJ

Operating junction temperature

–40

125

°C

Tstg

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±1500

pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage

4

28

V

VH

Hall amplifier input voltage

1

VCC – 0.5

V

TA

Operating free-air temperature

–40

100

°C

6.4 Thermal Information

TMP821

THERMAL METRIC(1)

D (SOIC)

UNIT

8 PINS

RθJA

Junction-to-ambient thermal resistance (2)

97

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

117.8

°C/W

RθJB

Junction-to-board thermal resistance

71.5

°C/W

ψJT

Junction-to-top characterization parameter

58.3

°C/W

ψJB

Junction-to-board characterization parameter

23.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

57.8

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Package thermal impedance is calculated in accordance with JESD 51-7.

4

Submit Documentation Feedback

Copyright © 2008–2015, Texas Instruments Incorporated

Product Folder Links: TMP821