TLV1112

1.2V, 0.8A LOW DROPOUT VOLTAGE REGULATOR

SLVS562B – DECEMBER 2004 – REVISED APRIL 2005

2

POST OFFICE BOX 655303

description/ordering information (continued)

The low-profile surface-mount KTP package allows the device to be used in applications where space is limited.

The TLV1112 requires a minimum of 10

mF of output capacitance for stability. Output capacitors of this size or

larger normally are included in most regulator designs.

Unlike pnp-type regulators, where up to 10% of the output current is wasted as quiescent current, the quiescent

current of the TLV1112 flows into the load, increasing efficiency.

The TLV1112C is characterized for operation over the virtual junction temperature range of 0

°C to 125°C. The

TLV1112I is characterized for operation over the virtual junction temperature range of − 40

°C to 125°C.

Continuous input voltage

20 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

150

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

package thermal data (see Note 1)

PACKAGE

BOARD

θJP‡

θJC

θJA

PowerFLEX

t/TO-252 (KTP)

High K, JESD 51-5

1.4

°C/W

19

°C/W

28

°C/W

SOT (DCY)

High K, JESD 51-7

4

°C/W

53

°C/W

TO-220 (KCS)

High K, JESD 51-5

3

°C/W

17

°C/W

19

°C/W

TO-263 (KTT)

High K, JESD 51-5

TBD

TBD

NOTE 1: Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

‡ For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, θJP is defined as the thermal resistance between the die

junction and the bottom of the exposed pad.

recommended operating conditions

MIN

MAX

UNIT

VIN

Input voltage

2.7

15

V

IOUT

Output current

800

mA

TJ

Operating virtual junction temperature range

TLV1112I

−40

125

°C

TJ

Operating virtual junction temperature range

TLV1112C

0

125

°C