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PACKAGE OUTLINE

C

8X

0.35

0.25

2X

2.4

0.8 MAX

(0.25)

(0.25)

(0.2)

(0.15)

0.05

0.00

8X

0.6

0.4

3 0.05

2.2 0.05

6X 0.8

A

4.1

3.9

B

4.1

3.9

(0.2) TYP

WSON - 0.8 mm max height

NGN0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214794/A 11/2019

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

4

5

8

PIN 1 ID

0.1

C A B

0.05

C

THERMAL PAD

EXPOSED

SYMM

SYMM

9

DETAIL A

SEE

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.000

PIN 1 ID

DETAIL A

PIN 1 ID