PCF8883USSLASH7EASLASH1 datasheet(26/35 Pages) NXP

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PCF8883

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Product data sheet

Rev. 4.1 — 14 September 2016

26 of 35

NXP Semiconductors

PCF8883

Capacitive touch/proximity switch with auto-calibration

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

20. Soldering of WLCSP packages

20.1 Introduction to soldering WLCSP packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note

AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface

mount reflow soldering description”.

Wave soldering is not suitable for this package.

All NXP WLCSP packages are lead-free.

20.2 Board mounting

Board mounting of a WLCSP requires several steps:

1. Solder paste printing on the PCB

2. Component placement with a pick and place machine

3. The reflow soldering itself

20.3 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 23) than a SnPb process, thus

reducing the process window

MSL: Moisture Sensitivity Level

Fig 22. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

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