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L6206

Application information

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Application information

A typical application using the L6206 device is shown in Figure 14. Typical component

values for the application are shown in Table 8. A high quality ceramic capacitor in the range

of 100 to 200 nF should be placed between the power pins (VSA and VSB) and ground near

the L6206 device to improve the high frequency filtering on the power supply and reduce

high frequency transients generated by the switching. The capacitors connected from the

ENA/OCDA and ENB/OCDB nodes to ground set the shutdown time for the bridge A and

bridge B respectively when an overcurrent is detected (see Section 5.3: Non-dissipative

overcurrent detection and protection on page 13). The two current sources (SENSEA and

SENSEB) should be connected to power ground with a trace length as short as possible in

the layout. To increase noise immunity, unused logic pins are best connected to 5 V (high

logic level) or GND (low logic level) (see Table 4: Pin description on page 6). It is

recommended to keep power ground and signal ground separated on the PCB.

Figure 14. Typical application (with reference to 24-pin packages)

Table 8. Component values for typical application

Component

Value

Component

Value

C1

100

FD1

1N4148

C2

100 nF

D2

1N4148

CBOOT

220 nF

RCLA

5 K



CP

10 nF

RCLB

5 K



CENA

5.6 nF

RENA

100 k



CENB

5.6 nF

RENB

100 k

