4

LM3478

SNVS085X – JULY 2000 – REVISED DECEMBER 2017

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Copyright © 2000–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input Voltage

45

V

FB Pin Voltage

–0.4< V

V FB < 7

V

FA/SD Pin Voltage

–0.4 < VFA/SD

VFA/SD< 7

V

Peak Driver Output Current

(<10µs)

1

A

Power Dissipation

Internally Limited

Junction Temperature

+150

°C

Lead Temperature

Vapor Phase (60 s)

215

°C

Infrared (15 s)

260

°C

DR Pin Voltage

–0.4

≤ VDR

VDR

≤ 8

V

ISEN Pin Voltage

500

mV

Tstg

Storage temperature

−65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings - LM3478

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

all pins(2)

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply Voltage

2.97

≤ VIN

VIN ≤ 40

V

Junction Temperature Range

−40 ≤ TJ

TJ ≤ +125

°C

Switching Frequency

100

≤ FSW

FSW ≤ 1

MHz