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STA333W データシート(PDF) 44 Page - STMicroelectronics

部品番号 STA333W
部品情報  2 channel high-efficiency digital audio system Sound Terminal
PDF  50 Pages
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メーカー  STMICROELECTRONICS [STMicroelectronics]
ホームページ  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STA333W データシート(HTML) 44 Page - STMicroelectronics

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Package thermal characteristics
STA333W
44/50
DocID13365 Rev 3
9
Package thermal characteristics
A thermal resistance of 25 °C/W can be achieved by mounting the device on a PCB which
has two copper ground areas of 3 x 3 cm and 16 vias (see Figure 21).
Given that the amount of power dissipated within the device depends primarily on the supply
voltage, load impedance and output modulation level the maximum estimated dissipated
power for the STA333W is 3 W.
With the above suggested board as heatsink, a maximum junction temperature rise,
Tj, of
75 °C is possible. In consumer environments where 50 °C is the maximum ambient
temperature this provides some safety margin before the intervention of the thermal
protection (Tj = 150 °C).
Figure 21. Double-layer PCB with two copper ground areas and 16 vias
Figure 22 shows the power derating curve for the PowerSSO-36 package on PCBs with
copper areas of 2 x 2 cm2 and 3 x 3 cm2.
Figure 22. Power derating curve for PCB used as heatsink
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Pd (W)
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Copper Area 2x2 cm
and via holes
STA333W
PSSO36
Copper Area 3x3 cm
and via holes
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Pd (W)
Tamb ( °C)
Copper Area 2x2 cm
and via holes
Copper Area 2x2 cm
and via holes
STA333W
PSSO36
STA333W
PSSO36
Copper Area 3x3 cm
and via holes
Copper Area 3x3 cm
and via holes
STA333W
PowerSSO-36



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