Figure 11. Forward voltage drop versus forward current

(typical values)

IF (A)

0.01

0.10

1.00

10.00

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

Tj = 25 °C

Tj = 125 °C

Tj = 75 °C

VF(V)

Figure 12. Thermal resistance junction to ambient versus

copper surface under each lead (typical values)

Rth(j-a)(°C/W)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMA

SCu(cm²)

Epoxy printed board FR4, eCu = 35 µm

Figure 13. Thermal resistance junction to ambient versus

copper surface under each lead (typical values)

Rth(j-a)(°C/W)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMB

SCu(cm²)

Epoxy printed board FR4, eCu = 35 µm

Figure 14. Thermal resistance junction to ambient versus

copper surface under each lead (typical values)

Rth(j-a)(°C/W)

0

50

100

150

200

250

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SCu(cm²)

Epoxy printed board FR4, eCu = 35 µm

SOD123Flat

Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat

Notch)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm

SMA Flat Notch

STPS1L40

Characteristics (curves)

DS1244 - Rev 9

page 5/16