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LP2997M/NOPB データシート(PDF) 3 Page - Texas Instruments |
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LP2997M/NOPB データシート(HTML) 3 Page - Texas Instruments |
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3 / 28 page ![]() LP2997 www.ti.com SNVS295F – MAY 2004 – REVISED APRIL 2013 Electrical Characteristics Specifications with standard typeface are for TJ = 25°C and limits in boldface type apply over the full Operating Temperature Range (TJ = 0°C to +125°C) (1). Unless otherwise specified, AVIN = 2.5V, PVIN = 1.8V, VDDQ = 1.8V. Symbol Parameter Conditions Min Typ Max Units VREF VREF Voltage PVIN = VDDQ = 1.7V 0.837 0.860 0.887 PVIN = VDDQ = 1.8V 0.887 0.910 0.937 V PVIN = VDDQ = 1.9V 0.936 0.959 0.986 ZVREF VREF Output Impedance IREF = -30 to +30 μA 2.5 k Ω VTT VTT Output Voltage IOUT = 0A PVIN = VDDQ = 1.7V 0.822 0.856 0.887 PVIN = VDDQ = 1.8V 0.874 0.908 0.939 PVIN = VDDQ = 1.9V 0.923 0.957 0.988 V IOUT = ±0.5A (2) PVIN = VDDQ = 1.7V 0.828 0.856 0.890 PVIN = VDDQ = 1.8V 0.878 0.908 0.940 PVIN = VDDQ = 1.9V 0.928 0.957 0.990 VosTT/VTT VTT Output Voltage Offset IOUT = 0A -25 0 25 (VREF-VTT) IOUT = -0.5A -25 0 25 mV IOUT = +0.5A -25 0 25 IQ Quiescent Current(3) IOUT = 0A (3) 320 500 µA ZVDDQ VDDQ Input Impedance 100 k Ω ISD Quiescent Current in SD = 0V 115 150 µA Shutdown(3) IQ_SD Shutdown Leakage Current SD = 0V 2 5 µA VIH Minimum Shutdown High 1.9 V Level VIL Maximum Shutdown Low 0.8 V Level ISENSE VSENSE Input Current 13 nA TSD Thermal Shutdown See(4) 165 Celsius TSD_HYS Thermal Shutdown 10 Celsius Hysteresis (1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. The limits are used to calculate Average Outgoing Quality Level (AOQL). (2) VTT load regulation is tested by using a 10 ms current pulse and measuring VTT. (3) Quiescent current defined as the current flow into AVIN. (4) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction to ambient thermal resistance, θJA, and the ambient temperature, TA. Exceeding the maximum allowable power dissipation will cause excessive die temperature and the regulator will go into thermal shutdown. Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LP2997 |
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