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OPA172IDBVT データシート(PDF) 40 Page - Texas Instruments |
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OPA172IDBVT データシート(HTML) 40 Page - Texas Instruments |
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40 / 60 page  www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 8X (0.25) (2) (2.7) 6X (0.5) (1.2) ( 0.2) VIA TYP (0.75) 8X (0.7) (R0.05) TYP (0.35) WSON - 0.8 mm max height DRG0008A PLASTIC SMALL OUTLINE - NO LEAD 4218885/A 03/2020 SYMM 1 4 5 8 LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:20X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED EXPOSED METAL METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) EXPOSED METAL |
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