RSS

CFILT

RESR

CIN

REF61xx

CL

AGND

VOUT

REFP

REFM

ADC

AGND

VIN

EN

Copyright © 2016, Texas Instruments Incorporated

28

REF6125, REF6130, REF6133, REF6141, REF6145, REF6150

SBOS747B – MAY 2016 – REVISED AUGUST 2016

www.ti.com

Product Folder Links: REF6125 REF6130 REF6133 REF6141 REF6145 REF6150

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Copyright © 2016, Texas Instruments Incorporated

12 Layout

12.1 Layout Guidelines

Figure 62 illustrates an example of a PCB layout for a data-acquisition system using the REF61xx. Some key

considerations are:

•

Connect low-ESR, 0.1-μF ceramic bypass capacitors between the VIN pin and ground.

•

Place the REF61xx output capacitor (CL) and the ADC as close to each other as possible.

•

Run two separate traces between VOUT_F, VOUT_S and the output capacitor, as shown in Figure 62.

•

Short the GND_F and GND_S pins with a solid plane, and extend this plane to connect to the output

capacitor CL, as shown in Figure 62.

•

Use a solid ground plane to help distribute heat and reduces electromagnetic interference (EMI) noise pickup.

•

Place the external components as close to the device as possible. This configuration prevents parasitic errors

(such as the Seebeck effect) from occurring.

•

Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if

possible, and only make perpendicular crossings when absolutely necessary.

12.2 Layout Example

Figure 62. Layout Example