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PACKAGE OUTLINE

C

6X

0.25

0.15

2X

1

4X

0.5

0.4 MAX

0.04

0.00

6X

0.27

0.17

0.54

2X

0.27

0.17

B

0.85

0.75

A

1.4

1.3

(0.102) TYP

4224755/B 10/2022

X2SON - 0.4 mm max height

DTM0008A

PLASTIC SMALL OUTLINE - NO LEAD

PIN 1 INDEX AREA

SEATING PLANE

0.05 C

1

3

4

7

0.1

C B A

0.05

C

SYMM

SYMM

PIN 1 ID

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad(s) must be soldered to the printed circuit board for thermal and mechanical performance.

2

5

6

8

SCALE 12.000