7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Analog inputs, , IN+, IN– (1)

Differential (VIN+) – (VIN–)

GND – 0.3

26

V

Common-mode (2)

GND – 0.3

26

V

Output (2)

GND – 0.3

(IN+) + 0.3

V

Operating temperature

–55

150

°C

Junction temperature

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

VIN+ and VIN– are the voltages at the IN+ and IN– terminals, respectively.

(2)

Input voltage at any terminal may exceed the voltage shown if the current at that terminal is limited to 5 mA.

7.2 ESD Ratings

MIN

MAX

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VS

Supply voltage range, voltage at IN+ pin

2.7

12

26

V

TA

Operating free-air temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC (1)

INA183

UNIT

DBV (SOT-23)

5 PINS

RθJA

Junction-to-ambient thermal resistance

164.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

60.1

°C/W

RθJB

Junction-to-board thermal resistance

36.6

°C/W

ψJT

Junction-to-top characterization parameter

10.3

°C/W

ψJB

Junction-to-board characterization parameter

36.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA183

SBOSA08 – FEBRUARY 2021

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