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SSM2311CBZ-R2 データシート(PDF) 17 Page - Analog Devices |
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SSM2311CBZ-R2 データシート(HTML) 17 Page - Analog Devices |
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17 / 20 page ![]() SSM2311 Rev. 0 | Page 17 of 20 OUTLINE DIMENSIONS SEATING PLANE 0.50 BSC BALL PITCH 1.575 1.515 1.455 1.750 1.690 1.630 0.28 0.24 0.20 0.35 0.32 0.29 0.65 0.59 0.53 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) A 1 2 3 B C BALL 1 IDENTIFIER Figure 48. 9-Ball Wafer Level Chip Scale Package [WLCSP] (CB-9-1) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option Branding SSM2311CBZ-R21 −40°C to +85°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-1 A1G SSM2311CBZ-REEL1 −40°C to +85°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-1 A1G SSM2311CBZ-REEL71 −40°C to +85°C 9-Ball Wafer Level Chip Scale Package [WLCSP] CB-9-1 A1G SSM2311-EVALZ1 Evaluation Board SSM2311-MINI-EVALZ1 Evaluation Board, 7 mm × 7 mm 1 Z = RoHS Compliant Part. |
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