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8003 データシート(PDF) 1 Page - VECTOR ELECTRONICS AND TECHNOLOGY, INC.

部品番号 8003
部品情報  Prototyping Boards (Circbord®)
PDF  4 Pages
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メーカー  VECTOR [VECTOR ELECTRONICS AND TECHNOLOGY, INC.]
ホームページ  https://www.vectorelect.com/
Logo VECTOR - VECTOR ELECTRONICS AND TECHNOLOGY, INC.

8003 データシート(HTML) 1 Page - VECTOR ELECTRONICS AND TECHNOLOGY, INC.

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11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708
Web site: http://www.vectorelect.com ELECTRONIC COMPANY
Toll-Free (800) 423-5659
Circuit Pattern:
3-Hole Solder Pad
Contacts:
N/A
Width/Thick:
6.50"/.062"
Height:
4.50"
16-Pin DIP Capacity:
20
Material:
CEM-1
Solder Terminals:
T42-1, K24C, K31C
Wire-Wrap Terminals:
T44, T46, T49, T68
Wire-Wrap Socket Pins:
R32
Hole Diameter:
.042"
Circuit Pattern:
Pad-Per-Hole
Contacts:
N/A
Width/Thick:
12.86"/.062"
Height:
4.00"
Contacts:
N/A
16-Pin DIP Capacity:
124
Material:
FR4 Epoxy Glass
Wire-Wrap Terminals:
T44, T46, T49, T68,
Solder Terminals:
T42-1
Wire-Wrap Socket Pins:
R32
Hole Diameter:
.042"
8010
4.0" x 13.0"
• Precision-Drilled,
plated-thru holes
• 0.080" diameter,
isolated solder pad
around each hole
• Board size and
surface area approxi-
mate Macintosh II
specifications
• Unrestricted
component
placement
VECTORBORD®
Prototyping Boards (Circbord®)
8001
4.50" x 6.5"
• Ideal for wire-wrap
applications
• Power and ground buses
etched onto wiring side
only
• Bus surfaces solder
coated for user
convenience
• Mount components with
0.3", 0.6" and 0.9" lead
spacing
• I/O area with solder pads
for mounting connector
8002
4.5" x 6.5"
Circuit Pattern:
Interleaved Buses
Contacts:
N/A
Width/Thick:
6.50"/.062"
Height:
4.50"
16-Pin DIP Capacity:
36
Material:
CEM-1
Solder Terminals:
T42-1
Wire-Wrap Terminals:
T44, T46, T49, T68
Wire-Wrap Socket Pins:
R32
Hole Diameter:
.042"
8003
4.5" x 6.5"
Circuit Pattern:
Pad-Per-Hole
Contacts:
N/A
Width/Thick:
6.50"/.062"
Height:
4.50"
16-Pin DIP Capacity:
60
Material:
CEM-1
Solder Terminals:
T42-1
Wire-Wrap Terminals:
T44, T46. T49. T68
Wire-Wrap Socket Pins:
R32
Hole Diameter:
.042"
• Square solder pad
etched around each
hole on wiring side
• Accommodates any
type DIP IC device or
discrete component
• Circuit pattern etched
onto wiring side only
• Solder mount DIP
sockets or IC devices
with any lead spacing
• 3-hole solder pads
(0.28" X 0.080") for
interconnecting multiple
component leads


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