| データシートサーチシステム |
|
8003 データシート(PDF) 1 Page - VECTOR ELECTRONICS AND TECHNOLOGY, INC. |
|
|
|||||||||||||||||||||||||||||
8003 データシート(HTML) 1 Page - VECTOR ELECTRONICS AND TECHNOLOGY, INC. |
|
1 / 4 page ![]() 11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708 Web site: http://www.vectorelect.com ELECTRONIC COMPANY Toll-Free (800) 423-5659 Circuit Pattern: 3-Hole Solder Pad Contacts: N/A Width/Thick: 6.50"/.062" Height: 4.50" 16-Pin DIP Capacity: 20 Material: CEM-1 Solder Terminals: T42-1, K24C, K31C Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" Circuit Pattern: Pad-Per-Hole Contacts: N/A Width/Thick: 12.86"/.062" Height: 4.00" Contacts: N/A 16-Pin DIP Capacity: 124 Material: FR4 Epoxy Glass Wire-Wrap Terminals: T44, T46, T49, T68, Solder Terminals: T42-1 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" 8010 4.0" x 13.0" • Precision-Drilled, plated-thru holes • 0.080" diameter, isolated solder pad around each hole • Board size and surface area approxi- mate Macintosh II specifications • Unrestricted component placement VECTORBORD® Prototyping Boards (Circbord®) 8001 4.50" x 6.5" • Ideal for wire-wrap applications • Power and ground buses etched onto wiring side only • Bus surfaces solder coated for user convenience • Mount components with 0.3", 0.6" and 0.9" lead spacing • I/O area with solder pads for mounting connector 8002 4.5" x 6.5" Circuit Pattern: Interleaved Buses Contacts: N/A Width/Thick: 6.50"/.062" Height: 4.50" 16-Pin DIP Capacity: 36 Material: CEM-1 Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46, T49, T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" 8003 4.5" x 6.5" Circuit Pattern: Pad-Per-Hole Contacts: N/A Width/Thick: 6.50"/.062" Height: 4.50" 16-Pin DIP Capacity: 60 Material: CEM-1 Solder Terminals: T42-1 Wire-Wrap Terminals: T44, T46. T49. T68 Wire-Wrap Socket Pins: R32 Hole Diameter: .042" • Square solder pad etched around each hole on wiring side • Accommodates any type DIP IC device or discrete component • Circuit pattern etched onto wiring side only • Solder mount DIP sockets or IC devices with any lead spacing • 3-hole solder pads (0.28" X 0.080") for interconnecting multiple component leads |
同様の部品番号 - 8003 |
|
同様の説明 - 8003 |
|
|
|
リンク URL |
| ALLDATASHEETはお客様のビジネスに役立ちますか? [ DONATE ] |
Alldatasheetは | 広告 | お問い合わせ | プライバシーポリシー | データシートへのリンク | リンク交換 | メーカーリスト All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |