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MPC7441 データシート(PDF) 29 Page - Freescale Semiconductor, Inc |
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MPC7441 データシート(HTML) 29 Page - Freescale Semiconductor, Inc |
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29 / 60 page ![]() MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4 Freescale Semiconductor 29 Package Description 8 Package Description The following sections provide the package parameters and mechanical dimensions for the HCTE package. 8.1 Package Parameters for the MPC7448, 360 HCTE BGA The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead high coefficient of thermal expansion ceramic ball grid array (HCTE). Package outline 25 × 25 mm Interconnects 360 (19 × 19 ball array – 1) Pitch 1.27 mm (50 mil) Minimum module height 2.32 mm Maximum module height 2.80 mm Ball diameter 0.89 mm (35 mil) Coefficient of thermal expansion12.3 ppm/°C |
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