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AP5G03DF データシート(PDF) 2 Page - A POWER MICROELECTRONICS

部品番号 AP5G03DF
部品情報  30V NP-Channel Enhancement Mode MOSFET
PDF  10 Pages
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メーカー  APME [A POWER MICROELECTRONICS]
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AP5G03DF データシート(HTML) 2 Page - A POWER MICROELECTRONICS

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AP5G03DF
30V N+P-Channel Enhancement Mode MOSFET
AP5G03DF RVE1.1
永源微電子科技有限公司
N-Channel Electrical Characteristics (TJ=25℃, unless otherwise noted)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
BVDSS
Drain-Source Breakdown Voltage
VGS=0V , ID=250uA
30
35
---
V
BVDSS/△TJ
BVDSS Temperature Coefficient
Reference to 25℃ , ID=1mA
---
0.023
---
V/℃
RDS(ON)
Static Drain-Source On-Resistance2
VGS=10V , ID=5A
---
18
25
VGS=4.5V , ID=3A
---
24
40
VGS(th)
Gate Threshold Voltage
VGS=VDS , ID =250uA
1.0
1.6
2.5
V
VGS(th)
VGS(th) Temperature Coefficient
---
-4.2
---
mV/℃
IDSS
Drain-Source Leakage Current
VDS=24V , VGS=0V , TJ=25℃
---
---
1
uA
VDS=24V , VGS=0V , TJ=55℃
---
---
5
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=6A
---
5.8
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
2.3
---
Ω
Qg
Total Gate Charge (4.5V)
VDS=20V , VGS=4.5V , ID=6A
---
5
---
nC
Qgs
Gate-Source Charge
---
1.11
---
Qgd
Gate-Drain Charge
---
2.61
---
Td(on)
Turn-On Delay Time
VDD=12V , VGS=10V , RG=3.3Ω
ID=6A
---
7.7
---
ns
Tr
Rise Time
---
46
---
Td(off)
Turn-Off Delay Time
---
11
---
Tf
Fall Time
---
3.6
---
Ciss
Input Capacitance
VDS=15V , VGS=0V , f=1MHz
---
416
---
pF
Coss
Output Capacitance
---
62
---
Crss
Reverse Transfer Capacitance
---
51
---
IS
Continuous Source Current1,6
VG=VD=0V , Force Current
---
---
6.2
A
ISM
Pulsed Source Current2,6
---
---
24
A
VSD
Diode Forward Voltage2
VGS=0V , IS=1A , TJ=25℃
---
---
1.2
V
Note :
1、The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2、The data tested by pulsed , pulse width ≦ 300us , duty cycle≦ 2%
3、The EAS data shows Max. rating . The test condition is VDD=24V,VGS=10V,L=0.1mH,IAS=21A
4、The power dissipation is limited by 150℃ junction temperature
5、The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.



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