PS9113

R08DS0124EJ0301 Rev.3.01

Page 11 of 15

Oct 29, 2018

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature

260

C or below (package surface temperature)

• Time of peak reflow temperature

10 seconds or less

• Time of temperature higher than 220

C

60 seconds or less

• Time to preheat temperature from 120 to 180

C 12030 s

• Number of reflows

Three

•

Flux

Rosin flux containing small amount of chlorine (The flux

with a maximum chlorine content of 0.2 Wt% is

recommended.)

(2) Wave soldering

 Temperature

260

C or below (molten solder temperature)

 Time

10 seconds or less

 Preheating conditions 120C or below (package surface temperature)

 Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

 Flux

Rosin flux containing small amount of chlorine (The flux with a maximum chlorine

content of 0.2 Wt% is recommended.)

(3) Soldering by Soldering Iron

 Peak Temperature (lead part temperature) 350C or below

 Time (each pins)

3 seconds or less

 Flux

Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt% is recommended.)

(a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead

(b) Please be sure that the temperature of the package would not be heated over 100

C

(4) Cautions

Fluxes

Avoid removing the residual flux with freon-based and halogens-based (chlorine-based) cleaning solvent .

220°C

Time (s)

(heating)

to 10 s

to 60 s

260°C MAX.

Recommended Temperature Profile of Infrared Reflow

120±30 s

(preheating)

180°C

120°C