SEP ELECTRONIC CORP.

KBPC35005 thru KBPC3510

35.0 A Single-Phase Silicon Bridge Rectifier

Rectifier Reverse Voltage 50 to 1000V

Maximum Ratings & Thermal Characteristics

Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.

For Capacitive load derate current by 20%.

Parameter

Symbol

unit

Maximum repetitive peak reverse voltage

Maximum RMS bridge input voltage

Maximum DC blocking voltage

Maximum average forward rectified

output current at TA=55 C

Peak forward surge current single sine-wave

superimposed on rated load (JEDEC Method)

Rating for fusing ( t<8.3ms)

Typical thermal resistance per element (1)

Operating junction and storage temperature

range

Electrical Characteristics

Rating at 25 C ambient temperature unless otherwise specified. Resistive or Inductive load, 60Hz.

For Capacitive load derate by 20 %.

Parameter

Symbol

Unit

Maximum instantaneous forward voltage drop

per leg at 17.5A

Maximum DC reverse current at rated TA =25 C

DC blocking voltage per element

TA =125 C

Isolation voltage from case to leads

VRRM

VRMS

VDC

IF(AV)

I t

2

IFSM

ReJA

TJ,

TSTG

VF

IR

50

100

200

400

800

1000

600

35

70

140

280

420

560

700

50

100

200

400

600

800

1000

V

V

V

A

A

V

A

2

sec

KBPC

35005

KBPC

3501

KBPC

3502

KBPC

3504

KBPC

3506

KBPC

3508

KBPC

3510

A

Vac

C / W

Features

Mechanical Data

This series is UL listed under the Recognized

Component Index, file number E142814

The plastic material used carries Underwriters Laboratory

flammability recognition 94V-0

Surge overload ratings to 400 amperes

High temperature soldering guaranteed 265 C/10

seconds at 5 lbs (2.3kg) tension

Case: Metal case

Terminals: Plated .25" (6.53mm) Faston

Mounting Position: Any

Weight: 0.706 ounce, 20 grams (approx)

Universal 4-way terminals, snap-on, wrap-around,

solder or P.C. Board mounting

Mounting Position: Bolt down on heat-sink with silicone thermal

compound between bridges and mounting surface for

maximum heat transfer efficiency

400

2.1

-55 to + 150

1.0

10

500

35

2500

664

KBPC

35005

KBPC

3501

KBPC

3502

KBPC

3504

KBPC

3506

KBPC

3508

KBPC

3510

Hole for

# 10 Screw

DIA.

+

5.35

0.25

+

28.55 0.25

+

16.2

0.5

+

14.3

0.5

+

11.10 0.13

0.78

+

16.2

0.5

+

28.55

0.25

6.35

+

18.1

0.5

+

24.1

1.3

Notes: (1)Thermal resistance from Junction to Ambemt on P.C.board mounting.

Dimensions in millimeters (1mm=0.0394＂）

2003 SEP ELECTRONIC CORP.

www.sep.net.cn

M099