TDA7719TR datasheet(43/45 Pages) STMICROELECTRONICS

43 / 45 page

TDA7719

Package information

43/45

Package information

In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®

packages. ECOPACK® packages are lead-free. The category of second Level Interconnect

is marked on the package and on the inner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to soldering conditions are also marked on the inner

box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 21.

TSSOP28 mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.200

0.047

0.050

0.150

0.002

0.006

0.800

1.000

1.050

0.031

0.039

0.041

0.190

0.300

0.007

0.012

0.090

0.200

0.004

0.008

D 1

9.600

9.700

9.800

0.378

0.382

0.386

6.200

6.400

6.600

0.244

0.252

0.260

E11

4.300

4.400

4.500

0.170

0.173

0.177

0.650

0.026

0.450

0.600

0.750

0.018

0.024

0.030

1.000

0.039

0˚ (min.), 8˚ (max.)

aaa

0.100

0.004

Note: 1. D and E1 does not include mold flash or protrusions.

Mold flash or potrusions shall not exceed 0.15mm

(.006inch) per side.

TSSOP28

0128292 B

Thin Shrink Small Outline Package

JEDEC MO-153-AC

TDA7719TR データシート(PDF) 43 Page - STMicroelectronics

TDA7719TR データシート(HTML) 43 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45

データシートダウンロード