LP T770

11 Version 1.2 | 2019-07-16

Recommended Solder Pad 9)

OHLPY977

1.2 (0.047)

6 (0.236)

heat dissipation

Cu-area > 16 mm

Cu-Fläche > 16 mm

2

for improved

Wärmeableitung

für verbesserte

Padgeometrie

Paddesign

2

Solder resist

Lötstopplack

6 (0.236)

1.2 (0.047)

Hole on PCB

2.8 (0.110)

2.4 (0.094)

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not

suitable for ultra sonic cleaning.