1E-3

1E-2

1E-1

1E+0

1E+1

1E+2 5E+2

1E-1

1E+0

1E+1

1E+2

Zth(j-a)(°C/W)

tp(s)

Fig. 6: Variation of thermal impedance junction to

ambient versus pulse duration (Printed circuit

board FR4 with recommended pad layout).

012345

40

50

60

70

80

90

100

Rth(j-a) (°C/W)

S(cm²)

Fig. 7: Thermal resistance junction to ambient ver-

sus copper surface under each lead (printed circuit

board FR4, e(Cu)=35

µm).

25

50

75

100

125

150

175

1E-4

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

1E+3

1E+4

IR(µA)

Tj(°C)

Fig .8: Variation of leakage current versus junction

temperature (typical values).

SM6HTxxA

4/5