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NRF51422-QFAC-R7 データシート(PDF) 4 Page - Nordic Semiconductor

部品番号 NRF51422-QFAC-R7
部品情報  Multiprotocol ANT™/Bluetooth® low energy System on Chip
PDF  115 Pages
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メーカー  NORDIC [Nordic Semiconductor]
ホームページ  https://www.nordicsemi.com/
Logo NORDIC - Nordic Semiconductor

NRF51422-QFAC-R7 データシート(HTML) 4 Page - Nordic Semiconductor

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Page 4
nRF51422 Product Specification v3.1
August 2014
3.0
Update to reflect the changes in build code:
• nRF51422-QFAA Fx0
• nRF51422-CEAA Cx0
• nRF51422-QFAB Bx0
(The x in the build codes can be any number between 0 and 9.)
If you are working with a previous revision of the chip, read version 2.x of the document.
Added content:
• Section 8.5.3 “Radio current consumption with DC/DC enabled” on page 50
• Section 11.1.1 “PCB layout example” on page 77
Updated content:
• Feature list on the front page.
• Section 2.1 “Block diagram” on page 10
• Section 3.2.1 “Code organization” on page 21
• Section 3.2.2 “RAM organization” on page 21
• Section 3.3 “Memory Protection Unit (MPU)” on page 22
• Section 3.4 “Power management (POWER)” on page 23
• Section 3.6 “Clock management (CLOCK)” on page 27
• Section 3.8 “Debugger support” on page 30
• Section 4.2 “Timer/counters (TIMER)” on page 32
• Chapter 5 “Instance table” on page 36
• Chapter 7 “Operating conditions” on page 38
• Section 8.1.2 “16 MHz crystal oscillator (16M XOSC)” on page 40
• Section 8.1.3 “32 MHz crystal oscillator (32M XOSC)” on page 41
• Section 8.1.4 “16 MHz RC oscillator (16M RCOSC)” on page 42
• Section 8.1.6 “32.768 kHz RC oscillator (32k RCOSC)” on page 43
• Section 8.1.7 “32.768 kHz Synthesized oscillator (32k SYNT)” on page 43
• Section 8.2 “Power management” on page 44
• Section 8.3 “Block resource requirements” on page 48
• Section 8.4 “CPU” on page 48
• Section 8.5.6 “Radio timing parameters” on page 54
• Section 8.5.7 “Antenna matching network requirements” on page 54
• Section 8.7 “Universal Asynchronous Receiver/Transmitter (UART) specifications”
on page 55
• Section 8.8 “Serial Peripheral Interface Slave (SPIS) specifications” on page 56
• Section 8.12 “Analog to Digital Converter (ADC) specifications” on page 60
• Section 8.13 “Timer (TIMER) specifications” on page 61
• Section 8.15 “Temperature sensor (TEMP)” on page 61
• Section 8.22 “Non-Volatile Memory Controller (NVMC) specifications” on page 64
• Section 8.24 “Low Power Comparator (LPCOMP) specifications” on page 65
• Section 9.2 “CDAB WLCSP package” on page 67
• Chapter 11 “Reference circuitry” on page 76
February 2014
2.1
Added content about the nRF51422-QFAB chip variant.
Updated content:
• Chapter 3.2.1 “Code organization” on page 21
• Chapter 3.2.2 “RAM organization” on page 21
• Chapter 3.3 “Memory Protection Unit (MPU)” on page 22
• Chapter 10.7.1 “nRF ICs” on page 75
• Chapter 11.3.1.1 “Bill of Materials” on page 80
• Chapter 11.3.2.1 “Bill of Materials” on page 82
• Chapter 11.3.3.1 “Bill of Materials” on page 84
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