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STTS424E02BDA3F データシート(PDF) 39 Page - STMicroelectronics |
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STTS424E02BDA3F データシート(HTML) 39 Page - STMicroelectronics |
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39 / 51 page ![]() STTS424E02 Maximum ratings 39/51 8 Maximum ratings Stressing the device above the ratings listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 25. Absolute maximum ratings Symbol Parameter Value Unit TSTG Storage temperature –60 to 150 °C TSLD (1) 1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C for between 90 to 150 seconds). Lead solder temperature for 10 seconds 260 °C VIO Input or output voltage - all pins VSS – 0.3 to VDD +0.5 V VDD Supply voltage VSS – 0.3 to 6.5 V IO Output current 10 mA PD Power dissipation 320 mW θJA Thermal resistance DA package 128 °C/W DN package 130 °C/W |
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