Package information

THBT15011, THBT20011, THBT27011

8/10

3

Package information

●

Epoxy meets UL94, V0

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

Table 7.

SO-8 dimensions

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

1.75

0.069

A1

0.1

0.25

0.004

0.010

A2

1.25

0.049

b

0.28

0.48

0.011

0.019

C

0.17

0.23

0.007

0.009

D

4.80

4.90

5.00

0.189 0.193 0.197

E

5.80

6.00

6.20

0.228 0.236 0.244

E1

3.80

3.90

4.00

0.150 0.154 0.157

e

1.27

0.050

h

0.25

0.50

0.010

0.020

L

0.40

1.27

0.016

0.050

L1

1.04

0.041

k

0°8°

0°8°

ppp

0.10

0.004

Figure 11.

Footprint dimensions

in mm (inches)

Figure 12.

Marking

E1

D

8

4

1

5

E

e

A

A2

b

A1

ppp C

C

k

h x 45°

L

L1

Seating

Plane

C

6.8

(0.268)

4.2

(0.165)

1.27

(0.050)

0.6

(0.024)

â

XXXXX : Marking

ZZ : Manufacturing location

Y : Year

WW : week

z z y w w

x x x x x x

Pin 1

â

XXXXX : Marking

ZZ : Manufacturing location

Y : Year

WW : week

z

z z

z y

y w

w w

w

x

x x

x x

x x

x x

x x

x

Pin 1