EMIF03-SIM02F2 datasheet(1/8 Pages) STMICROELECTRONICS

部品番号	EMIF03-SIM02F2

部品情報	3-line IPAD, EMI filter including ESD protection

PDF	8 Pages

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メーカー	STMICROELECTRONICS [STMicroelectronics]

ホームページ	http://www.st.com

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1 / 8 page

April 2008

Rev 6

1/8

8

EMIF03-SIM02F2

3-line IPAD™, EMI filter including ESD protection

Features

■ EMI symmetrical (I/O) low-pass filter

■ High efficiency in EMI filtering

■ Lead-free package

■ Very low PCB space consuming:

1.42 mm x 1.42 mm

■ Very thin package: 0.65 mm

■ High efficiency in ESD suppression

■ High reliability offered by monolithic integration

■ High reduction of parasitic elements through

integration and wafer level packaging

Complies with the following standards

■ IEC 61000-4-2, Level 4 on external and Vcc

pins:

– 15 kV (air discharge)

– 8 kV (contact discharge)

■ IEC 61000-4-2, Level 1 on internal pins:

– 2 kV (air discharge)

– 2 kV (contact discharge)

■ MIL STD 883E - Method 3015-6 Class 3

Applications

EMI filtering and ESD protection for:

■ SIM Interface (Subscriber Identify Module)

■ UIM Interface (Universal Identify Module)

Description

The EMIF03-SIM02F2 is a highly integrated

device designed to suppress EMI/RFI noise in all

systems subjected to electromagnetic

interference.The EMIF03 Flip Chip packaging

means the package size is equal to the die size.

This filter includes an ESD protection circuitry

which prevents damage to the application when

subjected to ESD surges up 15kV.

Figure 1.

Pin configuration (bump side)

Figure 2.

Configuration

TM: IPAD is a trademark of STMicroelectronics.

Flip Chip

(8 bumps)

B

C

1

2

3

A

RST

in

RST

ext

CLK

in

Data

in

Gnd

VCC

CLK

ext

Data

ext

47

Ω

CLK in

Data in

CLK ext

Data ext

100

Ω

R1

R2

R3

RST in

RST ext

100

Ω

VCC

GND

Cline = 20pF max.

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