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LM323K データシート(PDF) 11 Page - STMicroelectronics |
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LM323K データシート(HTML) 11 Page - STMicroelectronics |
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11 / 15 page  LM323 Package mechanical data 11/15 7 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. |
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