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TS4990 データシート(PDF) 25 Page - STMicroelectronics |
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TS4990 データシート(HTML) 25 Page - STMicroelectronics |
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25 / 32 page ![]() TS4990 Package information 25/32 Figure 67. Package mechanical data for 9-bump flip-chip package Figure 68. Daisy chain mechanical data The daisy chain sample features two-by-two pin connections. The schematics in Figure 68 illustrate the way pins connect to each other. This sample is used to test continuity on your board. Your PCB needs to be designed the opposite way, so that pins that are unconnected in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested. ■ Die size: 1.60 x 1.60 mm ±30µm ■ Die height (including bumps): 600µm ■ Bump diameter: 315µm ±50µm ■ Bump diameter before reflow: 300µm ±10µm ■ Bump height: 250µm ±40µm ■ Die height: 350µm ±20µm ■ Pitch: 500µm ±50µm ■ Coplanarity: 50µm max ■ * Back coating height: 100µm ±10µm * Optional 1.60 mm 1.60 mm 0.5mm 0.5mm ∅ 0.25mm 1.60 mm 1.60 mm 0.5mm 0.5mm ∅ 0.25mm 600µm 100µm 600µm 100µm A C B 1 2 3 1.6mm 1.6mm A C B 1 2 3 1.6mm 1.6mm |
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