TDA7513T datasheet(82/84 Pages) STMICROELECTRONICS

82 / 84 page

Package information

TDA7513T

82/84

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 21.

LQFP80 mechanical data & package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.600

0.0630

0.050

0.150 0.0020

0.0059

1.350

1.400

1.450 0.0531 0.0551 0.0571

0.220

0.320

0.380 0.0087 0.0126 0.0150

0.090

0.200 0.0035

0.0079

15.800 16.000 16.200 0.6220 0.6299 0.6378

13.800 14.000 14.200 0.5433 0.5512 0.5591

12.350

0.4862

15.800 16.000 16.200 0.6220 0.6299 0.6378

13.800 14.000 14.200 0.5433 0.5512 0.5591

12.350

0.4862

0.650

0.0256

0.450

0.600

0.750 0.0177 0.0236 0.0295

1.000

0.0394

0˚ (min.); 3.5˚ (typ,); 7˚ (max.)

ccc

0.100

0.0039

LQFP80 (14x14x1.40mm)

Low profile Quad Flat Package

0062342 D

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