Mechanical Data

TS4972

27/30

4

Mechanical Data

Figure 87: TS4972 Footprint Recommendation

(Non Solder Mask Defined)

Remarks:

Daisy chain sample is featuring pins connection two by two. The schematic above is illustrating the way

connecting pins each other. This sample is used for testing continuity on board. PCB needs to be

designed on the opposite way, where pin connections are not done on daisy chain samples. By that way,

just connecting an Ohmeter between pin 8 and pin 1, the soldering process continuity can be tested.

Order Codes

Figure 88: Top View Of The Daisy Chain Mechanical Data

( all drawings dimensions are in millimeters

Pad in Cu 35

µm with Flash NiAu (6µm, 0.15µm)

150

µm min.

500

µm

500

µm

Φ=250µm

Φ=400µm

75µm min.

100

µm max.

Track

Solder mask opening

Pad in Cu 35

µm with Flash NiAu (6µm, 0.15µm)

150

µm min.

500

µm

500

µm

Φ=250µm

Φ=400µm

75µm min.

100

µm max.

Track

Solder mask opening

Pad in Cu 35

µm with Flash NiAu (6µm, 0.15µm)

150

µm min.

500

µm

500

µm

Φ=250µm

Φ=400µm

75µm min.

100

µm max.

Track

Solder mask opening

Pad in Cu 35

µm with Flash NiAu (6µm, 0.15µm)

150

µm min.

500

µm

500

µm

Φ=250µm

Φ=400µm

75µm min.

100

µm max.

Track

Solder mask opening

Pad in Cu 35

µm with Flash NiAu (6µm, 0.15µm)

150

µm min.

500

µm

500

µm

Φ=250µm

Φ=400µm

75µm min.

100

µm max.

Track

Solder mask opening

12

4

5

6

7

3

8

Vin

Gnd

Bypass

Vout2

Stdby

Vcc

Vin+

Vout1

2.26 mm

1.6 mm

12

4

5

6

7

3

8

Vin

Gnd

Bypass

Vout2

Stdby

Vcc

Vin+

Vout1

2.26 mm

1.6 mm

Part Number

Temperature Range

Package

Marking

J

TSDC03IJT

-40, +85

°C

•

DC3